Connect-Tek USB-2 Manual do Utilizador

Consulte online ou descarregue Manual do Utilizador para Comutadores de rede Connect-Tek USB-2. Understanding and Performing USB 2.0 Physical Layer [en] Manual do Utilizador

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Introduction
Engineers involved in the design, characterization and
validation of USB 2.0 devices face daily pressures to speed
new products to the marketplace. Tektronix comprehensive
tool set enables designers to quickly and accurately perform
electrical compliance tests recommended by the USB-
Implementers Forum, Inc. (USBIF) and quickly debug
their designs.
Universal Serial Bus (USB 2.0) is a connectivity specification
aimed at peripherals that connect outside the computer in
order to eliminate the hassle of opening the computer case
to install cards needed for certain devices. USB-compliant
devices translate into ease-of-use, expandability and speed for
the user.
USB 2.0 device designers must properly characterize their
designs and verify compliance to industry standards before
device manufacturers can affix the “certified” USB-IF logo
to their packaging. The appropriate tool set is critical for
the performance of USB-IF compliance tests, such as eye
diagram and parametric testing for low-speed, full-speed and
high-speed devices and hubs.
Designs with USB 2.0 interfaces usually contain a variety
of signals and buses. Tools that provide complete system
visibility are needed to quickly verify and debug these designs.
These tools need to quickly discover USB 2.0 problems and
then they need to trigger on the problems to capture them.
Next, the tools should easily search, mark and navigate long
record lengths to find all problem occurrences. Finally, the
tools should have automated USB 2.0 decode that provides
insight to the design operation to quickly find the root cause of
the problem.
The first part of this application note focuses on understanding
and performing USB 2.0 physical layer measurements and
electrical compliance testing (electrical and high-speed tests)
and will include a discussion of the instruments required for
each test. The last part of this application note focuses on
debugging designs with USB 2.0 interfaces using a mixed
signal oscilloscope with USB 2.0 triggering, searching and
decoding capabilities.
Understanding and Performing USB 2.0
Physical Layer Testing and Debugging
Application Note
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Resumo do Conteúdo

Página 1 - Application Note

IntroductionEngineers involved in the design, characterization and validation of USB 2.0 devices face daily pressures to speed new products to the mar

Página 2 - USB 2.0 Electrical Tests

Application Note www.tektronix.com/usb10Effect of Oscilloscope Sample Rate on TestingTo capture information at edge speeds as fast as 500 ps, you need

Página 3 - Test Equipment

www.tektronix.com/usb 11Understanding and Performing USB 2.0 Physical Layer Testing and DebuggingTest FixtureThe test fixture is the most crucial compo

Página 4 - Drop Test

Application Note www.tektronix.com/usb12Debugging USB 2.0 DesignsProduct designs with USB 2.0 interfaces usually contain a wide variety of analog and

Página 5 - USB 2.0 High-speed Tests

www.tektronix.com/usb 13Understanding and Performing USB 2.0 Physical Layer Testing and DebuggingTime-Correlated Bus DecodeTime-correlated displays of

Página 6 - CHIRP Test

Application Note www.tektronix.com/usb14

Página 7 - Monotonicity Test

www.tektronix.com/usb 15Understanding and Performing USB 2.0 Physical Layer Testing and Debugging

Página 8 - 2.0 Physical Layer Testing

ConclusionUSB 2.0 technology provides the device designer a migration path for high-performance peripherals that preserve the ease-of-use consumers ha

Página 9 - Layer Testing

Application Note www.tektronix.com/usb2USB 2.0 Compliance Testing BasicsUSB 2.0 is a serial bus that utilizes a 4-wire system — VBUS, D-, D+ and Groun

Página 10 - Signal Source

www.tektronix.com/usb 3Understanding and Performing USB 2.0 Physical Layer Testing and DebuggingWhile performing compliance testing, you need to set u

Página 11

Application Note www.tektronix.com/usb4In-Rush Current CheckBecause USB 2.0 is a hot-pluggable technology, extreme care is required to ensure that the

Página 12 - Debugging USB 2.0 Designs

www.tektronix.com/usb 5Understanding and Performing USB 2.0 Physical Layer Testing and DebuggingTest EquipmentDrop tests require a multi-meter. The op

Página 13 - Search and Mark

Application Note www.tektronix.com/usb6Test EquipmentThe receiver sensitivity test requires a real-time oscilloscope, such as a MSO/DPO5204 or DPO7254

Página 14

www.tektronix.com/usb 7Understanding and Performing USB 2.0 Physical Layer Testing and DebuggingMonotonicity TestWhen performing a USB 2.0 high-speed

Página 15

Application Note www.tektronix.com/usb8Impedance Measurement TestDue to the high signal rates of USB 2.0 High-Speed mode, trace and packaging impedanc

Página 16 - Conclusion

www.tektronix.com/usb 9Understanding and Performing USB 2.0 Physical Layer Testing and DebuggingSelecting Tools for USB 2.0 Physical Layer TestingReal

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